Heraeus Printed Electronics and SUSS MicroTec Announce Partnership to Innovate Semiconductor Manufacturing

Heraeus Printed Electronics GmbH and SUSS MicroTec SE have officially declared a Joint Development Agreement to transform high-volume semiconductor manufacturing using digital inkjet technology. Announced on March 5, 2024, this collaboration aims to introduce digital printing solutions for metallic coatings, marking a significant shift towards mass production in the electronics sector.

The collaboration taps into Heraeus Printed Electronics' unique position as the sole provider of a comprehensive digital inkjet printing solution for electronic components, including metallic inks and in-depth process knowledge. This partnership is expected to enhance the semiconductor industry by facilitating efficient and flexible manufacturing processes.

Franz Vollmann, Head of Heraeus Printed Electronics, emphasized that this alliance is crucial for scaling their pioneering technology to mass production. He highlighted the synergy between Heraeus’ expertise in metallic inks and SUSS MicroTec’s specialization in scaling, aiming to establish a new industry benchmark.

SUSS MicroTec will contribute its advanced equipment and automation platforms, including the JETx system, designed to accommodate a wide range of printhead and substrate technologies. This integration promises to leverage Heraeus' unique digital printing technology, aiming at revolutionizing production efficiencies and costs.

Dr. Robert Wanninger of SUSS MicroTec expressed confidence in the collaboration, anticipating it to redefine production standards while meeting current and future market demands. The partnership seeks to develop a comprehensive system that optimizes costs and performance, potentially setting new precedents in the semiconductor industry.