LPKF Introduces LIDE Technology to Advance Chip Performance with Glass Substrates

On May 13, 2024, LPKF Laser & Electronics SE highlighted the need for enhanced chip performance due to the physical miniaturization limits of micro-chips. The German company pointed to the use of glass as a substrate in Advanced Packaging as a pivotal shift in semiconductor production. This material change is believed to accommodate dense configurations and improve efficiency.

LPKF’s LIDE technology (Laser Induced Deep Etching) enables precise, quick, and damage-free processing of glass substrates ranging from 100µm to 1.1mm. This capability is poised to support the semiconductor industry's transition towards using glass more extensively for high volume manufacturing of chip packages.

With increasing demand, LPKF has expanded production capacities at its Garbsen headquarters. The company’s CEO, Klaus Fiedler, confirmed that LIDE technology has matured to meet the stringent demands of the semiconductor industry. This technological advancement offers LPKF's clients enhanced precision and flexibility, expanding design possibilities for chip packaging.