PRESS RELEASE published on 07/28/2025 at 19:41, 6 months 6 days ago EQS-Adhoc: SUSS adjusts its guidance for gross profit margin and EBIT margin in financial year 2025 SUSS MicroTec SE adjusts 2025 guidance for gross profit margin and EBIT margin based on preliminary figures and ongoing analysis Financial Analysis Preliminary Figures SÜSS MicroTec SE Guidance Adjustment 2025 Forecast
BRIEF published on 06/04/2025 at 10:35, 7 months 29 days ago L'assemblée générale annuelle de SUSS MicroTec SE approuve une augmentation de 50 % du dividende et réélit Jan Smits Croissance De L'entreprise Approbation Des Actionnaires Perspectives 2025 Augmentation Des Dividendes Réélection De Jan Smits
BRIEF published on 06/04/2025 at 10:35, 7 months 29 days ago SUSS MicroTec SE AGM Approves 50% Dividend Increase and Re-Elects Jan Smits Shareholder Approval Dividend Increase Company Growth 2025 Outlook Jan Smits Re-Election
PRESS RELEASE published on 06/04/2025 at 10:30, 7 months 29 days ago Annual General Meeting approves dividend proposal and re-elects Jan Smits to the Supervisory Board SUSS MicroTec SE's Annual General Meeting approves 50% dividend increase to € 0.30 per share, re-elects Jan Smits to Supervisory Board, and presents growth plans for 2025 Supervisory Board Dividend Increase SÜSS MicroTec SE Jan Smits 2025 Growth Plans
BRIEF published on 05/26/2025 at 08:05, 8 months 8 days ago SUSS MicroTec lance la plateforme de liaison hybride XBC300 Gen2 D2W SÜSS MicroTec Semi-conducteur Liaison Hybride Collage De Puces Sur Plaquettes Technologies De Circuits Intégrés 3D
BRIEF published on 05/26/2025 at 08:05, 8 months 8 days ago SUSS MicroTec Launches XBC300 Gen2 D2W Hybrid Bonding Platform SÜSS MicroTec Semiconductor Hybrid Bonding Die-to-wafer Bonding 3D IC Technologies
PRESS RELEASE published on 05/26/2025 at 08:00, 8 months 8 days ago SUSS presents the XBC300 Gen2 D2W platform – the integrated and precise solution for the future of die-to-wafer hybrid bonding SUSS introduces the XBC300 Gen2 D2W platform, offering high precision and space savings for die-to-wafer hybrid bonding in semiconductor manufacturing Semiconductor Industry Precision Hybrid Bonding SUSS XBC300 Gen2 D2W Platform
BRIEF published on 05/08/2025 at 07:35, 8 months 26 days ago SUSS MicroTec Reports Strong Sales Growth in Q1 2025 Sales Growth SÜSS MicroTec Semiconductor Q1 2025 Tariff Risks
BRIEF published on 05/08/2025 at 07:35, 8 months 26 days ago SUSS MicroTec annonce une forte croissance de ses ventes au premier trimestre 2025 Croissance Des Ventes SÜSS MicroTec Semi-conducteur T1 2025 Risques Tarifaires
PRESS RELEASE published on 05/08/2025 at 07:30, 8 months 26 days ago SUSS continues high sales growth in the first quarter of 2025 SUSS MicroTec SE reports 31.8% sales growth in Q1 2025, with margins and guidance confirmed. Key driver: bonder orders related to AI. Expansion plans in Taiwan progressing as planned Sales Growth SÜSS MicroTec SE Quarterly Statement Taiwan Expansion AI Bonder Orders
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Published on 02/03/2026 at 19:37, 21 minutes ago ams-OSRAM AG: ams OSRAM sells non-optical analog/mixed-signal sensor business to Infineon for EUR 570 m in cash, reduces pro-forma leverage ratio to 2.5 and is creating the leader in Digital Photonics
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Published on 02/03/2026 at 17:45, 2 hours 13 minutes ago Chiffre d’affaires 2025 en croissance à 11,2 M€ (+5%)
