BRIEF published on 08/07/2024 at 07:30, 3 months 14 days ago SUSS MicroTec Reports Strong Q2 Growth and Margin Expansion Financial Report Order Intake Semiconductors Sales Expansion Q2 Growth
PRESS RELEASE published on 08/07/2024 at 07:25, 3 months 14 days ago SUSS MicroTec continues strong growth and significant margin expansion in the second quarter SUSS MicroTec SE reports strong growth, increased margins in Q2 2024. Order book at €450.0 million. Sales up 45.6% to €192.8 million in H1 2024. Gross profit margin improves to 39.8% Semiconductor Industry Financial Report Growth SÜSS MicroTec Margin Expansion
BRIEF published on 07/18/2024 at 19:28, 4 months 2 days ago SÜSS MicroTec relève ses prévisions pour l'année 2024 après de solides performances au premier semestre Prévisions Financières Marge EBIT Hausse Des Revenus Prises De Commandes Bénéfice Brut
BRIEF published on 07/18/2024 at 19:28, 4 months 2 days ago SÜSS MicroTec Raises Full-Year 2024 Guidance Following Strong First Half-Year Performance Revenue Growth Order Intake EBIT Margin Financial Forecast Gross Profit
PRESS RELEASE published on 07/18/2024 at 19:23, 4 months 2 days ago EQS-Adhoc: SUSS MicroTec raises full-year 2024 guidance following strong first half-year performance SUSS MicroTec raises full-year 2024 guidance after strong first half-year performance. Positive sales and earnings momentum anticipated Sales Outlook Earnings SÜSS MicroTec Full-year Guidance
BRIEF published on 05/13/2024 at 09:05, 6 months 8 days ago SÜSS MicroTec lance XBC300 Gen2 : une plateforme de liaison hybride polyvalente SÜSS MicroTec Fabrication De Semi-conducteurs XBC300 Gen2 D2W/W2W Liaison Hybride Intégration De Puces 3D
BRIEF published on 05/13/2024 at 09:05, 6 months 8 days ago SÜSS MicroTec Launches XBC300 Gen2: A Versatile Hybrid Bonding Platform Semiconductor Manufacturing SÜSS MicroTec Hybrid Bonding 3D Chip Integration XBC300 Gen2 D2W/W2W
PRESS RELEASE published on 05/13/2024 at 09:00, 6 months 8 days ago SUSS MicroTec presents hybrid bonding all-rounder XBC300 Gen2 D2W/W2W SUSS MicroTec SE introduces XBC300 Gen2 D2W/W2W, a hybrid bonding all-rounder platform enabling various bonding processes on 200mm and 300mm substrates, with space-saving features Innovation Semiconductor Industry SÜSS MicroTec SE Hybrid Bonding XBC300 Gen2 D2W/W2W
BRIEF published on 05/08/2024 at 07:35, 6 months 13 days ago SÜSS MicroTec annonce un bon début d'exercice 2024 avec une croissance prometteuse et des marges améliorées Croissance Performance Financière Exercice 2024 SÜSS MicroTec Semi-conducteur
BRIEF published on 05/08/2024 at 07:35, 6 months 13 days ago SÜSS MicroTec Reports Strong Start to Fiscal Year 2024 with Promising Growth and Improved Margins Financial Performance Fiscal Year 2024 Growth SÜSS MicroTec Semiconductor
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